Simcenter FLOEFD 2205
New Version
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플로우마스터코리아
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2022-09-01 14:20
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| 분석(Analysis)이 Design Process의 필수적인 부분이 되기 위해서는 Design Process를 쉽게 사용하고 적용할 수 있어야 합니다.
엔지니어를 위해 개발된 Simcenter FLOEFD는 CFD분석을 CAD 용 Plug-in으로 변환되며, 직관적인 Interface로 사용이 매우 쉬워 실제로 대부분의 설계 엔지니어가 8시간 미만의 교육만으로도 Simcenter FLOEFD를 사용할 수 있다고 알려져있습니다.Simcenter FLOEFD는 CFD 시뮬레이션의 강력한 기능을 제공합니다. NX, Creo, CATIA V5, Solid Edge에서 직접 사용하여 설계 프로세스를 중단하지 않고도 작업을 할 수 있습니다. 형상(geometry)이나 경계조건(boundary conditions) 변경이 결과에 미치는 영향을 쉽게 이해하고, 빠르고 빈번한 What-if 분석을 수행하며, 선호하는 CAD 플랫폼 내에서 통찰력 있는 보고서를 생성할 수 있습니다. 빠르고 정확한 기술을 기반으로 구축된 Simcenter FLOEFD는 전체 시뮬레이션 시간을 최대 75% 단축하고 생산성을 최대 40배 향상할 수 있도록 지원하고 있습니다.이러한 Simcenter FLOEFD 2205가 다음과 같은 새로운 기능을 추가하여 새로 Release 되었습니다. |
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| ● 더 빨라진 CFD meshing 및 복잡하거나 낮은 품질의 CAD 형상 처리 | ||
| ● Xcelerator Share – 클라우드 기반 엔지니어링 협업 지원 | ||
| ● 향상된 1D Element로 3D CFD를 분석하는 속도가 빨라짐 | ||
| ● PCB 열 분석 정확도 옵션 및 EDA Bridge 워크플로 개선 | ||
| ● 구조 분석의 다중 물리학 기능 등 | ||
| 1. Go Faster | ||
| ◎ Faster CFD meshing and handling of complex or low quality CAD Geometry | ||
| A new “Mesh Boolean” technology enables you to handle complex and extremely bad CAD geometry even faster and easier than before. When CAD Boolean cannot conduct Boolean operations successfully because of bad or dirty geometry (bad topology with missing entities, self-intersecting faces, etc.), the Mesh Boolean option can be used. | ||
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| A few examples of complex or difficult CAD geometry | ||
| Mesh Boolean first meshes bodies separately and then conducts Boolean operations of the meshed bodies without using any CAD Boolean operations. This technology can prepare and mesh, even very dirty models, 5-15 times faster and easier without any user prior adjustments or healing of the model, i.e., automatically. | ||
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| In previous versions “CAD Boolean” is the default option. “Preprocessor Boolean” is FLOEFD’s Boolean approach activated with “Improved Geometry Handling”. The new Mesh Boolean technology can be used together with the CAD Boolean diagnostic, combining the power of Mesh Boolean and the convenience of getting additional information, such as a diagnostic of the fluid domain. If the CAD Boolean diagnostic fails to detect the fluid domain, you still can proceed and mesh the model with Mesh Boolean. In that case additional subdomain diagnostics will be displayed in the Solver Monitor dialog. You are free to choose the default way of handling the geometry (CAD Boolean, Preprocessor Boolean (formerly called “Improved Geometry Handling” mode) or Mesh Boolean, as well as you can disable the CAD Boolean diagnostics | ||
| ◎ 1D Elements in 3D CFD – speed up simulation with multiple chains | ||
| 1D Elements were introduced in Simcenter FLOEFD 2021.2.1. These allow you to simulate a pipe with a 1D solver. You can convert a pipe into a chain of 1D Elements and solve their fluid and thermal interactions using 1D CFD embedded in 3D CFD Simcenter FLOEFD. This allows you to increase simulation speed and reduce mesh requirements. The 1D Elements feature doesn’t require any module or additional license and now you can create multiple chains with this release. Take a look back at this blog that introduced 1D elements for introductory information and a video. | ||
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| Multiple chains -1D Elements within a 3D CFD analysis | ||
| 2. Stay Integrated | |||
| ◎ Cloud based collaboration: Simcenter FLOEFD with Xcelerator Share | |||
| Xcelerator Share is a cloud-based collaboration service that supports distributed working environments and is available with many Siemens software subscriptions. It is part of the Xcelerator Portfolio and provides: | |||
| ● Secure cloud storage with desktop syncing | |||
| ● Permission-based project sharing with task management | |||
| ● Engineering-centric view & markup | |||
| ● Any device, any time, browser-based access to data | |||
| Xcelerator Share is now supported by Simcenter FLOEFD 2205. Leveraging Xcelerator Share allows you to set up collaboration projects, synchronize files to cloud storage directly from Simcenter FLOEFD running on your desktop, send messages and receive notifications, and also review and mark up documents. This supports more easily working with engineering colleagues in different departments, different locations and even with external suppliers and consultants.
Find out more in this example video below showing a project to improve a heatsink design in a liquid cooled power electronics IGBT module. |
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| ◎ CGNS (CFD General Notation System) Export | |||
| You can export static and transient results into CGNS format in two ways: CGNS file is created by Simcenter FLOEFD or the CGNS file is created by another tool, imported into Simcenter FLOEFD and Simcenter FLOEFD outputs results values into the originally created CGNS file. The latter approach is recommended. For example, you can use CGNS export for acoustic analysis in Simcenter 3D based on FLOEFD field distribution. More about CGNS: CFD General Notation System (cgns.github.io). | |||
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| 3. Model the complexity | |||
| ◎ Electronics cooling – PCB thermal analysis and workflow enhancements | |||
| ● EDA Bridge related enhancements | |||
| PCB Localized Copper Modeling – Layered (Detailed) Thermal Territories | |||
| Layered (Detailed) Thermal Territories. A Thermal Territory around a package can now be represented in Layered (formerly called Detailed) mode in addition to the already existing Explicit Thermal Territory Type. Layered Thermal Territories Provides an accuracy to account for the local variation of copper below a component. In Layered mode each layer is given an effective thermal conductivity. Suggested use is with footprint components such as simple, 2R and Delphi component thermal representations. Thermal properties can be calculated for each layer based on the copper in imported boards or set by the user. |
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| You can easily define precedence of the overlapped Thermal Territories, so the territory with higher precedence will be applied in the overlapping region. | |||
| Smart PCB – Via Filler and Pin Filler Material definition | |||
| You can set material for Via Filler and Pin Filler in Explicity and Layered (Detailed) in Explicity or Layered mode. Currently you can define up to 4 different materials for Explicit or Layered modes. In Smart PCB mode, filler materials and via and pin groups can be adjusted after importing and the number of materials is not limited. | |||
| Smart PCB Solder mask support | |||
| You can add solder mask as solder top (smt) and solder bottom (smb) layers. You can define solder mask thickness and material. In the Smart PCB mode additional bodies are created for solder mask, please check the thickness of solder mass in advance. You can choose to add solder mask or not in the Model Summary dialog upon transferring. | |||
| Smart PCB Via Plating direction – In/Out | |||
| For a via group with plating you can now define whether the obtained via diameter is the hole diameter before plating (so the final hole diameter after plating will be smaller for the double thickness of plating) or after the plating (so the obtained diameter is the final hole diameter after plating). | |||
| Smart PCB Thermo-mechanical analysis memory requirements reduction | |||
| For Smart PCB Structural analysis, the memory requirement for PCB homogenization has been significantly reduced by 2 to 30 times. The homogenization mesher and solver was further accelerated. This allows making structural simulations of extremely large and complex PCBs on desktop computers feasible. For more information on PCB homogenization please read more in the Simcenter FLOEFD 2021.3 blog. | |||
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| ● New structural analysis enhancements | |||
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| A new type of contact allows simulating loosening contact (in terms of linear approach): if the gap width between bodies is much less than the element size then the contact is treated as a “Sliding” contact in the portion of the contact area where surfaces are pressed together. Otherwise, the contact is not applied and the bodies are disconnected. The originally non-deformed surfaces in contact must coincide or overlap to let Simcenter FLOEFD find the contact area using Boolean operations. Please use “Specific Force” postprocessor parameters or its components to locate resulting contact area. There are many more enhancements in Simcenter FLOEFD 2205 that can be explored in the release highlights document on Support Center for clients. These include incremental topics such as new Goals e.g Total Energy Balance, Volumetric Heat Generation Rate, Mass of solid and more through to improved visualization of Films on angled surfaces. |
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